Remove solder mask from edge connector
This commit is contained in:
parent
6ade9f5e5e
commit
b659bb7382
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@ -4374,6 +4374,19 @@
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(zone (net 0) (net_name "") (layers "*.Mask") (tstamp be4c3353-35c1-499d-ac62-6645b7c8c93c) (hatch edge 0.5)
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(connect_pads (clearance 0.508))
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(min_thickness 0.25) (filled_areas_thickness no)
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(fill (thermal_gap 0.5) (thermal_bridge_width 0.5))
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(polygon
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(pts
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(xy 188.3 69.8)
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(xy 193.1 69.7)
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(xy 193.1 105.3)
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(xy 188.4 105.4)
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)
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)
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)
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(zone (net 0) (net_name "") (layer "F.Mask") (tstamp 2d69de4f-ec23-4c47-97db-4538a8779dc2) (hatch edge 0.5)
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(zone (net 0) (net_name "") (layer "F.Mask") (tstamp 2d69de4f-ec23-4c47-97db-4538a8779dc2) (hatch edge 0.5)
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(connect_pads (clearance 0.508))
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(connect_pads (clearance 0.508))
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(min_thickness 0.25) (filled_areas_thickness no)
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(min_thickness 0.25) (filled_areas_thickness no)
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@ -1,12 +1,12 @@
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%TF.GenerationSoftware,KiCad,Pcbnew,7.0.2*%
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%TF.GenerationSoftware,KiCad,Pcbnew,7.0.2*%
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%TF.CreationDate,2024-05-19T00:21:07+02:00*%
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%TF.CreationDate,2024-05-19T13:58:45+02:00*%
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%TF.ProjectId,dsoxlan,64736f78-6c61-46e2-9e6b-696361645f70,rev?*%
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%TF.ProjectId,dsoxlan,64736f78-6c61-46e2-9e6b-696361645f70,rev?*%
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%TF.SameCoordinates,Original*%
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%TF.SameCoordinates,Original*%
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%TF.FileFunction,Soldermask,Bot*%
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%TF.FileFunction,Soldermask,Bot*%
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%TF.FilePolarity,Negative*%
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%TF.FilePolarity,Negative*%
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%FSLAX46Y46*%
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%FSLAX46Y46*%
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G04 Gerber Fmt 4.6, Leading zero omitted, Abs format (unit mm)*
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G04 Gerber Fmt 4.6, Leading zero omitted, Abs format (unit mm)*
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G04 Created by KiCad (PCBNEW 7.0.2) date 2024-05-19 00:21:07*
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G04 Created by KiCad (PCBNEW 7.0.2) date 2024-05-19 13:58:45*
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%MOMM*%
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%MOMM*%
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%LPD*%
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%LPD*%
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G01*
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@ -114,4 +114,44 @@ X176800000Y-83700000D03*
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@ -1,12 +1,12 @@
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%TF.GenerationSoftware,KiCad,Pcbnew,7.0.2*%
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%TF.GenerationSoftware,KiCad,Pcbnew,7.0.2*%
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%TF.CreationDate,2024-05-19T00:21:07+02:00*%
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%TF.CreationDate,2024-05-19T13:58:45+02:00*%
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%TF.ProjectId,dsoxlan,64736f78-6c61-46e2-9e6b-696361645f70,rev?*%
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%TF.ProjectId,dsoxlan,64736f78-6c61-46e2-9e6b-696361645f70,rev?*%
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%TF.SameCoordinates,Original*%
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%TF.SameCoordinates,Original*%
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%TF.FileFunction,Soldermask,Top*%
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%TF.FileFunction,Soldermask,Top*%
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%TF.FilePolarity,Negative*%
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%TF.FilePolarity,Negative*%
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%FSLAX46Y46*%
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%FSLAX46Y46*%
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G04 Gerber Fmt 4.6, Leading zero omitted, Abs format (unit mm)*
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G04 Gerber Fmt 4.6, Leading zero omitted, Abs format (unit mm)*
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G04 Created by KiCad (PCBNEW 7.0.2) date 2024-05-19 00:21:07*
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G04 Created by KiCad (PCBNEW 7.0.2) date 2024-05-19 13:58:45*
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%MOMM*%
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%MOMM*%
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%LPD*%
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%LPD*%
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G01*
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G01*
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@ -153,6 +153,26 @@ X174700000Y-85900000D03*
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X173160000Y-74100000D03*
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X178800000Y-78400000D03*
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G01*
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@ -173,23 +193,43 @@ X179676000Y-109000000D01*
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112
gerbers/dsoxlan-job.gbrjob
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112
gerbers/dsoxlan-job.gbrjob
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@ -0,0 +1,112 @@
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{
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"Header": {
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"GenerationSoftware": {
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"Vendor": "KiCad",
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"Application": "Pcbnew",
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"Version": "7.0.2"
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},
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"CreationDate": "2024-05-19T13:58:46+02:00"
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},
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"GeneralSpecs": {
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"ProjectId": {
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"Name": "dsoxlan",
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"GUID": "64736f78-6c61-46e2-9e6b-696361645f70",
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"Revision": "rev?"
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},
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"Size": {
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"X": 81.38,
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"Y": 58.52
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},
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"LayerNumber": 2,
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"BoardThickness": 1.6,
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"Finish": "None"
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},
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"DesignRules": [
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{
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"Layers": "Outer",
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"PadToPad": 0.2,
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"PadToTrack": 0.2,
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"TrackToTrack": 0.2,
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"MinLineWidth": 0.5,
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"TrackToRegion": 0.508,
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"RegionToRegion": 0.508
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}
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],
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"FilesAttributes": [
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{
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"Path": "dsoxlan-F_Cu.gbr",
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"FileFunction": "Copper,L1,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "dsoxlan-B_Cu.gbr",
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"FileFunction": "Copper,L2,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "dsoxlan-F_Silkscreen.gbr",
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"FileFunction": "Legend,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "dsoxlan-F_Mask.gbr",
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"FileFunction": "SolderMask,Top",
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"FilePolarity": "Negative"
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},
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{
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"Path": "dsoxlan-B_Mask.gbr",
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"FileFunction": "SolderMask,Bot",
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"FilePolarity": "Negative"
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},
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{
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"Path": "dsoxlan-Edge_Cuts.gbr",
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"FileFunction": "Profile",
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"FilePolarity": "Positive"
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}
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],
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"MaterialStackup": [
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{
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"Type": "Legend",
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"Name": "Top Silk Screen"
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},
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{
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"Type": "SolderPaste",
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"Name": "Top Solder Paste"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Top Solder Mask"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "F.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 1.51,
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"Material": "FR4",
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"Name": "F.Cu/B.Cu",
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"Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "B.Cu"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Bottom Solder Mask"
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},
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{
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"Type": "SolderPaste",
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"Name": "Bottom Solder Paste"
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},
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{
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"Type": "Legend",
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"Name": "Bottom Silk Screen"
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}
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]
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}
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