{ "Header": { "GenerationSoftware": { "Vendor": "KiCad", "Application": "Pcbnew", "Version": "8.0.4" }, "CreationDate": "2024-09-19T00:07:34+03:00" }, "GeneralSpecs": { "ProjectId": { "Name": "dsoxlan", "GUID": "64736f78-6c61-46e2-9e6b-696361645f70", "Revision": "rev?" }, "Size": { "X": 81.38, "Y": 58.52 }, "LayerNumber": 2, "BoardThickness": 1.6, "Finish": "None" }, "DesignRules": [ { "Layers": "Outer", "PadToPad": 0.2, "PadToTrack": 0.2, "TrackToTrack": 0.2, "MinLineWidth": 0.4, "TrackToRegion": 0.508, "RegionToRegion": 0.508 } ], "FilesAttributes": [ { "Path": "dsoxlan-F_Cu.gbr", "FileFunction": "Copper,L1,Top", "FilePolarity": "Positive" }, { "Path": "dsoxlan-B_Cu.gbr", "FileFunction": "Copper,L2,Bot", "FilePolarity": "Positive" }, { "Path": "dsoxlan-F_Silkscreen.gbr", "FileFunction": "Legend,Top", "FilePolarity": "Positive" }, { "Path": "dsoxlan-F_Mask.gbr", "FileFunction": "SolderMask,Top", "FilePolarity": "Negative" }, { "Path": "dsoxlan-B_Mask.gbr", "FileFunction": "SolderMask,Bot", "FilePolarity": "Negative" }, { "Path": "dsoxlan-Edge_Cuts.gbr", "FileFunction": "Profile", "FilePolarity": "Positive" } ], "MaterialStackup": [ { "Type": "Legend", "Name": "Top Silk Screen" }, { "Type": "SolderPaste", "Name": "Top Solder Paste" }, { "Type": "SolderMask", "Thickness": 0.01, "Name": "Top Solder Mask" }, { "Type": "Copper", "Thickness": 0.035, "Name": "F.Cu" }, { "Type": "Dielectric", "Thickness": 1.51, "Material": "FR4", "Name": "F.Cu/B.Cu", "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" }, { "Type": "Copper", "Thickness": 0.035, "Name": "B.Cu" }, { "Type": "SolderMask", "Thickness": 0.01, "Name": "Bottom Solder Mask" }, { "Type": "SolderPaste", "Name": "Bottom Solder Paste" }, { "Type": "Legend", "Name": "Bottom Silk Screen" } ] }